Handbook of tape automated bonding

Handbook of tape automated bonding

4.11 - 1251 ratings - Source

Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB problem solving methods, and those who must choose a high-performance and cost-effective packaging technique for their interconnect systems, here's a timely summary of progress in all aspects of this fascinating field.Attaching multiple TAB-bonded integrated circuits to a transmission line can create sources of reflected waves or noise voltage. A perfect ... These structures are also susceptible to reflected voltage waves within the power supply distribution network. ... In order to minimize the potential costs and risks of design errors, automatic design tools are recommended for multichip interconnect substrates.

Title:Handbook of tape automated bonding
Author: John H. Lau
Publisher:Kluwer Academic Pub - 1992

You must register with us as either a Registered User before you can Download this Book. You'll be greeted by a simple sign-up page.

Once you have finished the sign-up process, you will be redirected to your download Book page.

How it works:
  • 1. Register a free 1 month Trial Account.
  • 2. Download as many books as you like (Personal use)
  • 3. Cancel the membership at any time if not satisfied.

Click button below to register and download Ebook
Privacy Policy | Contact | DMCA