Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

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An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: Provides in-depth coverage of a wide range of state-of-the-art technologies and applications Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.[27] reported that charge-based end-point detection coupled with advanced process control (APC) can be used to adjust the ... the variations that can be observed from wafer-to-wafer and lot-to-lot 6000 4800 inin g t h i c k n e s s ( A… ) 3600 2400 1200 0 150 120 90 60 30 ... 11.15 A schematic view of a hybrid- ECMP system.

Title:Microelectronic Applications of Chemical Mechanical Planarization
Author: Yuzhuo Li
Publisher:John Wiley & Sons - 2008

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